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PACK EXPO preview: Winery installs Packaging Line of the Year

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October 16, 2008 - Special free session at Conference at PACK EXPO, describes winner of 2008 Packaging Line of the Year (PLOY) competition sponsored by Packaging Machinery Technology magazine, Arlington, VA. Presentation at 2 p.m. on Monday, 10 November 2008 describes line at Ste. Michelle Wine Estate, Woodinville, WA, occurs in conjunction with PACK EXPO International, 9-13 November 2008 at McCormick Place, Chicago, IL. Line relies on new case partition inserting technology developed by Wayne Automation Corp., Norristown, PA, as well as equipment from Fleetwood GoldcoWyard AMBEC, St. Albans, Hertfordshire, UK; FKI Logistex/Alvey Systems Inc., St. Louis, MO; Krones, Inc., Franklin, WI; Hartness International Inc., Greenville, SC; Pearson Packaging Systems, Spokane, WA; Wulftec/MJ Maillis Group, Ayer’s Cliff, QC, Canada; Emmeti USA, LLC, Tampa, FL. Integration services from Barry-Wehmiller Design Group, St. Louis, MO, also play integral role to achieve smaller carbon footprint, significant cost/material savings, reduced changeover time, increased throughput. Although there is no fee to attend PLOY presentation at Conference at PACK EXPO, attendees still must register for session.


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