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PACK EXPO preview: Automation eases packaging challenges

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September 16, 2008 - Automation solutions from Bosch Rexroth, Hoffman Estates, IL, solve typical packaging challenges such as maximizing uptime, productivity, ease-of-use. Exhibiting at PACK EXPO International, 9-13 November 2008, McCormick Place, Chicago, IL, company demonstrates full-line automated solutions in tandem with gantry, delta robots, horizontal form-fill-seal machinery, bottle filler as well as range of automation products from electric drive, controls, pneumatics, linear motion, assembly technology groups. Suitable for sophisticated packaging, robotics applications, Rexroth’s motion logic controller (MLC) controls up to 16 robotic kinematics concurrently, up to 65 axes of motion, plus logic. Newest MLC Version 4 firmware provides advanced camming, flex profile capabilities to help reduce engineering time, improve cycle time of machine or entire packaging line. Linear motion eLINE compact modules address applications with less rigorous linear motion speed, load requirements up to 60 kilograms.


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