PACK EXPO preview: Packaging showcase honors winners

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August 28, 2008 - The Showcase of Packaging Innovations™ at PACK EXPO International, 9-13 November 2008, McCormick Place, Chicago, IL, inspires new ideas with display of more than 300 award-winning packages from around world. Showcase, sponsored by Dow Chemical Co., Midland, MI, for third year in row, also houses PACK EXPO Selects finalists where attendees cast vote for favorite packaging designs, structures, processes submitted by PACK EXPO exhibitors. Winning packages on display come from 14 competitions including ABRE Design and Packaging Award (Brazilian Packaging Association); AMEE Stellar Packaging Awards (Association Mexicana de Envase y Embalaje); DuPont Awards for Packaging Innovation; Flexible Packaging Achievement Awards (Flexible Packaging Association); Clear Choice Awards (Glass Packaging Institute); Compliance Package of the Year (Healthcare Compliance Packaging Council); Estrella del Sur (Instituto Argentino Del Envase); IMDA Awards (In-Mold Decorating Association); AmeriStar Competition (Institute of Packaging Professionals), Japan Packaging Contest (Japan Packaging Institute), NACD Packaging Awards (National Association of Container Distributors), Print Quality Awards (Packaging and Labeling Gravure Association), National Paperboard Packaging Competition (Paperboard Packaging Council).


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